Huawei and Qualcomm have announced the completion of one of the industry's first interoperability tests on dual carrier HSPA+ (High Speed Packet Access Plus) technology. The test, which reached a peak downlink data rate of 42Mb/s, said to be the fastest downlink rate experienced by 3G end-users, demonstrates that dual-carrier HSPA+ technology is ready for commercial deployment, say the pair.
Huawei's latest HSPA+ solution and Qualcomm's Mobile Data Modem (MDM) MDM8220 chipsets were used in the interoperability test. Implemented with dual cell technology, Huawei's HSPA+ solution can transmit data via two or more carriers, resulting in the downlink data rate of 42Mb/s, which is claimed to improve an operator's spectrum resources, enhances spectral efficiency and provides capacity gains of up to 20%.
"Qualcomm is pleased to be working with Huawei to bring dual-carrier HSPA+ technologies to market," said Alex Katouzian, vice president of product management, Qualcomm CDMA Technologies. "We remain committed to WCDMA modem leadership and the seamless and cost-effective commercialization of next-generation technologies around the world."
Wan Biao, President of Wireless, Huawei, said, "Achieving higher speeds is a constant pursuit for customers and their subscribers. As a customer-centric company, Huawei is dedicated to developing innovative technology and cost-effective solutions and services. In cooperation with Qualcomm, we are able to deliver the latest in commercially available mobile broadband technology and user devices."