Qualcomm has introduced new visual processing technology to its Snapdragon range aimed at supporting “next-generation user experiences” such as virtual reality and computer vision.
System-on-chips (SoCs) are becoming so complicated that even chipset companies themselves are unable to understand how they work, the CTO of debugging tech firm UltraSoC has claimed.
Samsung has started the mass production of its 1.0μm-pixel-based 16 megapixel (Mp) CMOS image sensor, which it said will deliver high quality picture taking in thin smartphones.
Qualcomm is betting on chips for lower tier smartphones, small cells, data centres and the Internet of Things to turn it around as it announced 15 percent job cuts and plans to save more than $1 billion (€910 million).
There is no end to the wonders of pizza; as we discovered this week, it played a pivotal role in the mobile industry.
MediaTek is now second only to Qualcomm in the LTE baseband market, which grew 27 percent in Q1 to $5.8 billion (€5.2 billion).
Chipmaker Intel is planning to push further into the Internet of Things market after agreeing to take over rival Altera in a $16.7 billion (€15 billion) cash only deal.
Qualcomm is working with Google to produce the first smartphone for the latter's Project Tango 3D mapping platform.
Avago Technologies has bought Broadcom in a deal worth $37 billion (€33.7 billion), as it aims to create a communications semiconductor giant.
Qualcomm has added two new Wi-Fi chips to its Internet of Things (IoT) portfolio.
MediaTek has launched the world’s first 10-core mobile CPU, featuring three processor clusters and an integrated “WorldMode” LTE modem.
Market leaders Qualcomm and Apple face a challenging year in the mobile CPU space as rivals continue to ramp up shipments.
Intel launched its MWC portfolio this morning, comprising new chips, network architecture and security products.
Qualcomm has revealed new 3D fingerprint scanning technology amid several launches at MWC spanning LTE and the connected home.
Qualcomm has introduced four new CPUs to its mid-tier 600 and 400 series that support high-end features, including LTE-Advanced and 4K video capture.
Samsung has entered mass production of its upcoming Exynos 7 Octa SoC, using its new 14nm FinFET process.
Samsung has entered mass production of embedded package on package (ePop) memory for high-end smartphones, which combines essential memory components onto a single board.
ARM has unveiled a new suite of high performing and energy efficient processors, which it said will power smartphones from next year onwards.
Qualcomm has shrugged off a reported snub from Samsung by announcing it has more than 60 devices in the pipeline featuring its Snapdragon 810 processor.
Industry veterans have discussed the short-term challenges that the Internet of Things must overcome before it can worry about hitting ambitious predictions about what the technology can achieve by 2020.
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By Ari Vänttinen, CMO, Comptel
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